Display panels and manufacturing methods thereof, display devices and spliced display devices

ABSTRACT

Provided are a display panel and a manufacturing method thereof, a display device and a spliced display device. The display panel includes: a color filter substrate (11), an array substrate (12) and a first conductive portion (13), where a display region (AA) and a peripheral region (NA) are formed on the display panel, and the peripheral region (NA) surrounds the display region (AA); the array substrate (12) includes pixel circuits and a second conductive portion (14), where the pixel circuits are located in the display region (AA), and the second conductive portion (14) is located in the peripheral region (NA); the second conductive portion (14) is connected with the pixel circuits; the first conductive portion (13) is located on a side surface of the array substrate (12) and a side surface of the color filter substrate (11), and the first conductive portion (13) is connected with the second conductive portion (14). By such technical solutions, a width of the peripheral region can be reduced, which is beneficial to realizing a narrow bezel and increasing a screen-to-body ratio.

TECHNICAL FIELD

The present application relates to the field of display technologies,and in particular, to a display panel and a manufacturing methodthereof, a display device and a spliced display device.

BACKGROUND

In the related art, with continuous integration and development ofdisplay and control technologies, super-large pictures, multi-screendisplay, and clear and realistic display effects make commandmonitoring, commercial centers, high-level conferences, private theatersand other industries more inclined to select ultra-large-size displayscreens. However, in the field of large-screen display systemengineering, costs for manufacturing ultra-large-size display screens ofmore than 100 inches are much higher than that for manufacturinglarge-size display screens of 55 inches, etc., and due to limitations oftechnologies and equipment, a maximum size of a single liquid crystaldisplay screen is 110 inches. Therefore, a display device formed bysplicing a plurality of screens has appeared.

However, since liquid crystals in a liquid crystal display panel havefluidity, the liquid crystals needs to be sealed within a specificregion by using a sealant, and positions of the sealant cannot be usedfor display. Moreover, in a glass cutting process, a certain distanceneeds to be reserved for grinding of the display panel, so as to ensurethat a pixel region of the display panel can display normally. Thiscauses a “seam” that cannot be completely eliminated in a spliced liquidcrystal display screen. How to reduce a width of the “seam” is atechnical problem that needs to be solved.

SUMMARY

The present disclosure provides a display panel and a manufacturingmethod thereof, a display device and a spliced display device.

According to a first aspect of embodiments of the present disclosure,there is provided a display panel, including: a color filter substrate,an array substrate and a first conductive portion, where a displayregion and a peripheral region are formed on the display panel, and theperipheral region surrounds the display region;

the color filter substrate is opposite to the array substrate; the arraysubstrate includes pixel circuits and a second conductive portion, wherethe pixel circuits are located in the display region, and the secondconductive portion is located in the peripheral region; the secondconductive portion is connected with the pixel circuits; the pixelcircuits and the second conductive portion are located on a side of thearray substrate facing the color filter substrate; and

the first conductive portion is located on a side surface of the arraysubstrate and a side surface of the color filter substrate, a first endof the first conductive portion is located on the side surface of thecolor filter substrate, a second end of the first conductive portion islocated on the side surface of the array substrate, and the firstconductive portion is connected with the second conductive portion.

In an embodiment, a distance between the first end of the firstconductive portion and the second end of the first conductive portion issmaller than a distance between a first surface of the color filtersubstrate away from the array substrate and a second surface of thearray substrate away from the color filter substrate.

In an embodiment, the first conductive portion is located between afirst central axis of the side surface of the color filter substrate anda second central axis of the side surface of the array substrate; thefirst central axis and the second central axis are respectivelyperpendicular to a direction from the first end of the first conductiveportion to the second end of the first conductive portion.

In an embodiment, the first conductive portion is manufactured through atransfer printing process; a distance between the first end of the firstconductive portion and the first central axis is a first distance, and adistance between the second end of the first conductive portion and thesecond central axis is a second distance, where the first distance isequal to the second distance.

In an embodiment, the display panel further includes: chip-on-films,where the chip-on-films are bonded together with the first conductiveportion, and the chip-on-films are electrically connected with the firstconductive portion.

In an embodiment, the display panel further includes: a conductive filmlayer, where the conductive film layer is located between the firstconductive portion and the chip-on-films, and the first conductiveportion is in electrical communication with the chip-on-films throughthe conductive film layer.

In an embodiment, the first conductive portion includes a plurality offirst conductive portions, and the conductive film layer covers all thefirst conductive portions;

the plurality of first conductive portions include a plurality ofcentral conductive portions and a plurality of edge conductive portions,where the central conductive portions are located in middle of theplurality of first conductive portions, and the edge conductive portionsare located in edges of the plurality of first conductive portions; and

the chip-on-films are connected with the plurality of central conductiveportions through the conductive film layer.

In an embodiment, the display panel further includes: a printed circuitboard, where the printed circuit board is located on a side of thechip-on-films away from the array substrate, and is connected with thechip-on-films.

In an embodiment, a width of part of a chip-on-film located near theprinted circuit board is smaller than a width of part of thechip-on-film located near the array substrate.

In an embodiment, a light emitting side of the color filter substrateand a light incident side of the array substrate are respectivelyattached with a polarizer.

In an embodiment, the display panel further includes: a first polarizerand a second polarizer, where the first polarizer is located on a sideof the color filter substrate away from the array substrate, and thesecond polarizer is located on a side of the array substrate away fromthe color filter substrate;

the color filter substrate includes a first edge and a second edge,where the first edge is located on a first side of the color filtersubstrate, and the second edge is located on a second side of the colorfilter substrate, where the second side is a side other than the firstside, and the first conductive portion is located on the first side ofthe color filter substrate;

a distance between a third edge of the first polarizer located on thefirst side and the first edge is 0.05˜1.7 mm, and the third edge isparallel to the first edge; a distance between a fourth edge of thefirst polarizer located on the second side and the second edge is 0˜0.1mm, and the fourth edge is parallel to the second edge;

the array substrate includes a fifth edge and a sixth edge, where thefifth edge is located on the first side of the array substrate, and thesixth edge is located on the second side of the array substrate; and

a distance between a seventh edge of the second polarizer located on thefirst side and the fifth edge is 0.1˜1.7 mm, and the seventh edge isparallel to the fifth edge; a distance between an eighth edge of thesecond polarizer located on the second side and the sixth edge is 0˜0.1mm, and the eighth edge is parallel to the sixth edge.

In an embodiment, the display panel further includes: a first lightshielding layer, a second light shielding layer, a first water andoxygen barrier layer, and a second water and oxygen barrier layer, where

the color filter substrate includes a first edge region and a firstcentral region, where the first edge region surrounds the first centralregion; a projection of the first polarizer on the color filtersubstrate is located within the first central region;

the first light shielding layer is located on a side of the color filtersubstrate facing the first polarizer, and the first light shieldinglayer is located in the first edge region and covers side surfaces ofthe first polarizer; the first water and oxygen barrier layer covers thefirst light shielding layer;

the array substrate includes a second edge region and a second centralregion, where the second edge region surrounds the second centralregion; a projection of the second polarizer on the array substrate islocated within the second central region; and

the second light shielding layer is located on a side of the arraysubstrate facing the second polarizer, and the second light shieldinglayer is located in the second edge region and covers side surfaces ofthe second polarizer; the second water and oxygen barrier layer coversthe second light shielding layer.

In an embodiment, the color filter substrate includes a third lightshielding layer and a fourth light shielding layer;

the peripheral region includes a first sub-region and a secondsub-region, where the first sub-region is located between the displayregion and the first conductive portion, and the second sub-region is aregion other than the first sub-region in the peripheral region;

a projection of the third light shielding layer on the array substrateis located within the first sub-region, and a projection of the fourthlight shielding layer on the array substrate is located within thesecond sub-region; and

a width of the third light shielding layer is 0.6˜1.0 mm, and a width ofthe fourth light shielding layer is 0.25˜0.5 mm.

According to a second aspect of the embodiments of the presentdisclosure, there is provided a display device, including: a lightemitting module and the above-described display panel, where

the display panel is located on a light emitting side of the lightemitting module, and the array substrate is located between the colorfilter substrate and the light emitting module.

In an embodiment, the light emitting module includes a back plate, amiddle frame, an optical film layer and a light plate, where

the back plate includes a bottom plate and a side wall; the light plateis located on a side of the bottom plate facing the display panel, andincludes a plurality of light sources; the middle frame is disposedaround the plurality of light sources, and is fixedly connected with theside wall; the middle frame is located between the bottom plate and theoptical film layer.

In an embodiment, a projection of the optical film layer on the colorfilter substrate is located within a projection of the array substrateon the color filter substrate, and a projection of the middle frame onthe array substrate is located within a projection of the optical filmlayer on the array substrate.

In an embodiment, the display device further includes: a fifth lightshielding layer and a metal layer, where

the fifth light shielding layer is located on a side surface of thecolor filter substrate and a side surface of the array substrate;

the metal layer covers the fifth light shielding layer, and is locatedon a side surface of the light emitting module; when the display panelincludes a first polarizer, a first end of the metal layer is located ona side of the first polarizer away from the color filter substrate andlocated in the peripheral region, and a second end of the metal layer islocated on a side of the light emitting module away from the displaypanel.

In an embodiment, on a first side of the optical film layer, in a firstdirection, a distance between an edge of the optical film layer and themetal layer is a third distance, and a distance between the middle frameand the edge of the optical film layer is a fourth distance, where thefirst direction is parallel to a surface of the optical film layerfacing the display panel, the third distance is equal to the fourthdistance, and the third distance is 0.3˜0.5 mm; and

on a second side of the optical film layer, in the first direction, thedistance between the edge of the optical film layer and the metal layeris a fifth distance, and the distance between the middle frame and theedge of the optical film layer is a sixth distance, where the sixthdistance is greater than or equal to the fifth distance, the fifthdistance is 0.1˜0.3 mm, and the sixth distance is 0.3˜0.5 mm.

In an embodiment, on a first side of the bottom plate, the middle frameincludes a first side surface and a second side surface, where the firstside surface is connected with the second side surface, the first sidesurface is an inclined plane inclined from the peripheral region to thedisplay region, and the second side surface extends along a seconddirection, the second direction is perpendicular to a surface of theoptical film layer facing the display panel;

when the display panel includes chip-on-films, each of the chip-on-filmsincludes a chip and a flexible circuit board, where the chip is fixed onthe flexible circuit board; and

the display panel further includes a printed circuit board, where theprinted circuit board is located on a side of the chip-on-films awayfrom the array substrate, and is connected with the chip-on-films.

In an embodiment, on the first side of the bottom plate, the side wallincludes a first vertical extension portion, a first horizontalextension portion and a second vertical extension portion, where thefirst vertical extension portion is connected with the bottom plate, andextends along the second direction; the first horizontal extensionportion is located between the first vertical extension portion and thesecond vertical extension portion; an extension direction of the firsthorizontal extension portion is perpendicular to the second direction,and the first horizontal extension portion extends in a direction fromthe display region to the peripheral region; the second verticalextension portion extends along the second direction; and

the light emitting module further includes a support block, where thesupport block is located at a connection between the first verticalextension portion and the first horizontal extension portion, and thesupport block is located between the first vertical extension portionand the printed circuit board for supporting the printed circuit board.

In an embodiment, the light emitting module further includes aprotection plate for protecting the printed circuit board; and

the protection plate is located on a side of the printed circuit boardaway from the support block, and the protection plate, the middle frameand the back plate are fixed together.

In an embodiment, the protection plate includes a first protectionportion and a second protection portion, where the first protectionportion is connected with the second protection portion, the firstprotection portion extends along the second direction, the printedcircuit board is located between the first protection portion and thesupport block, an extension direction of the second protection portionis perpendicular to the second direction, and the second protectionportion is located on a side of the printed circuit board away from thedisplay panel;

the middle frame includes a first support portion, a second supportportion and a third support portion, where the second support portion islocated between the first support portion and the third support portion,the first support portion is located on the bottom plate, an extensiondirection of the first support portion is perpendicular to the seconddirection, the second support portion extends along the seconddirection, and the third support portion is configured to support theoptical film layer;

the light emitting module further includes a first fastener, where thefirst fastener passes through the second vertical extension portion, thethird support portion and the first protection portion; and

a first support point of the third support portion to the optical filmlayer, a second support point of the second support portion to the thirdsupport portion, and a contact point between the third support portionand the first fastener are vertexes of a mechanical triangle.

In an embodiment, the third support portion includes a third sidesurface, a fourth side surface and a fifth side surface, where the thirdside surface, the fourth side surface and the fifth side surface facethe optical film layer, the fourth side surface is located between thethird side surface and the fifth side surface, the third side surface isa plane for supporting the optical film layer, an angle between thefourth side surface and a surface of the optical film layer facing themiddle frame is an acute angle, and the fifth side surface is a convexarc surface;

a width of the third side surface in a first direction is 0.2˜0.3 mm,the first direction is perpendicular to the second direction, the anglebetween the fourth side surface and the surface of the optical filmlayer facing the middle frame is 23˜33 degrees, and a radius of a spherewhere the convex arc surface is located is 10˜15 mm; and

the second support portion includes a sixth side surface, where thesixth side surface is located on a side of the second support portionfacing the optical film layer, and the sixth side surface is a plane.

In an embodiment, the light emitting module further includes a firstreflective film layer, where the first reflective film layer is locatedon a surface of the middle frame facing the optical film layer;

the first reflective film layer covers the fifth side surface, a part ofthe fourth side surface and a part of the sixth side surface;

on a side of the middle frame close to the optical film layer, thereexists a gap between the first reflective film layer and the third sidesurface, and on a side of the middle frame close to the bottom plate,there exists a gap between the first reflective film layer and the firstsupport portion; and

the first reflective film layer is a reflective sticker or a white filmlayer.

In an embodiment, on the side of the middle frame close to the opticalfilm layer, a distance between the first reflective film layer and thethird side surface is 2.5 to 5 mm, and on the side of the middle frameclose to the bottom plate, a distance between the first reflective filmlayer and the first support portion is less than or equal to 2 mm.

In an embodiment, there are four middle frames; every two of the fourmiddle frames are adjacent to each other, and the four middle framesenclose a quadrilateral; and two adjacent middle frames are fixedlyconnected with each other.

In an embodiment, the light emitting module further includes an embeddedcorner block, where the embedded corner block is configured to fixedlyconnect two adjacent middle frames;

the embedded corner block includes a first connection portion and asecond connection portion, where the first connection portion isconnected with the second connection portion, and an extension directionof the first connection portion intersects with an extension directionof the second connection portion; and

the first connection portion is fixedly connected with one of the twoadjacent middle frames, and the second connection portion is fixedlyconnected with the other one of the two adjacent middle frames.

In an embodiment, one of the two adjacent middle frames includes a firstgroove, and the other one of the two adjacent middle frames includes asecond groove; and

the first connection portion is located in the first groove, and a depthof the first groove is the same as a thickness of the first connectionportion; the second connection portion is located in the second groove,and a depth of the second groove is the same as a thickness of thesecond connection portion.

In an embodiment, one of the two adjacent middle frames includes a firstpositioning hole, and the other one of the two adjacent middle framesincludes a second positioning hole; and

the first connection portion includes a first positioning column, andthe second connection portion includes a second positioning column,where the first positioning column is located in the first positioninghole, and the second positioning column is located in the secondpositioning hole.

In an embodiment, an opening is formed on a side close to the bottomplate between the two adjacent middle frames.

In an embodiment, the light emitting module further includes a secondreflective film layer, where the second reflective film layer is locatedat a connection between the two adjacent middle frames, and a width ofthe second reflective film layer increases in a direction from theoptical film layer to the bottom plate.

In an embodiment, the plurality of light sources are arranged in anarray, and a light source array formed by the plurality of light sourcesis symmetrical.

In an embodiment, the light source array includes M rows of lightsources arranged along the first direction, and N rows of light sourcesarranged along a third direction, where M and N are integers greaterthan 6 respectively, and the first direction intersects with the thirddirection;

in the first direction, a light distance between a first light sourceand a second light source is a first light distance, a light distancebetween the second light source and a third light source is a secondlight distance, a light distance between an (N−2)^(th) light source andan (N−1)^(th) light source is the second light distance, a lightdistance between the (N−1)^(th) light source and an N^(th) light sourceis the first light distance, and a light distance between two adjacentlight sources in remaining light sources is a third light distance,where the second light distance is greater than the third lightdistance, and the third light distance is greater than the first lightdistance;

in the third direction, a light distance between a first light sourceand a second light source is a fourth light distance, a light distancebetween the second light source and a third light source is a fifthlight distance, a light distance between an (N−2)^(th) light source andan (N−1)^(th) light source is the fifth light distance, a light distancebetween the (N−1)^(th) light source and an Nth light source is thefourth light distance, and a light distance between two adjacent lightsources in remaining light sources is the third light distance, wherethe fifth light distance is greater than the third light distance, andthe third light distance is greater than the fourth light distance.

In an embodiment, in any one of the first direction and the thirddirection, a distance between a side of the first reflective film layeron the second support portion facing the optical film layer and a lightsource adjacent to the second support portion is a seventh distance, adistance between the side of the first reflective film layer on thesecond support portion facing the optical film layer and an edge of theoptical film layer close to the middle frame is an eighth distance, aprojection of a surface of the second support portion facing the opticalfilm layer on the optical film layer is a projection point, an acuteangle between the second direction and a line between the light sourceadjacent to the second support portion and the projection point is afirst angle, the second direction is perpendicular to the surface of theoptical film layer facing the display panel, an acute angle between thesecond direction and a line between the light source adjacent to thesecond support portion and a connection point of the second supportportion and the third support portion is a second angle, and areflectance of a surface of the third support portion facing the opticalfilm layer, a luminous flux per unit angle of the light source atdifferent angles of light emission, the seventh distance, the eighthdistance, the first angle and the second angle satisfy the followingrelationship:

$\frac{a}{b} \approx \frac{\int_{0}^{\alpha}{xdr}}{\int_{\alpha}^{\beta}{fxdr}}$

where a is a value of the seventh distance, b is a value of the eighthdistance, α is a value of the first angle, β is a value of the secondangle, x is the luminous flux, and r is an angle of light emission.

In an embodiment, the display device further includes: a thirdreflective film layer, where the third reflective film layer is locatedon a side of the light plate facing the optical film layer, and ispressed on a bottom end of the first support portion.

In an embodiment, a top end surface of the middle frame is coated with ahot melt adhesive/optical curable adhesive for fixing an edge of theoptical film layer to the top end surface of the middle frame; and

when the display panel includes a second polarizer, and the secondpolarizer is located on a side of the array substrate away from thecolor filter substrate, an edge of the second polarizer is coated withthe optical curable adhesive for fixing the array substrate and thecolor filter substrate on the optical film layer.

In an embodiment, the hot melt adhesive includes a resin material, and atransmittance of the hot melt adhesive is 80%˜99.5%; and

the optical curable adhesive includes the resin material, and atransmittance of the optical curable adhesive is 80%˜99.5%.

In an embodiment, the optical film layer includes a light transmittingglass plate, a light diffusing film and a brightness enhancement film,where the light diffusing film is located on a side of the lighttransmitting glass plate away from the array substrate, and thebrightness enhancement film is located on a side of the lighttransmitting glass plate facing the array substrate.

According to a third aspect of the embodiments of the presentdisclosure, there is provided a spliced display device, including: atleast two display devices, and at least one of the at least two displaydevices is the above-described display device.

According to a fourth aspect of the embodiments of the presentdisclosure, there is provided a method of manufacturing a display panel,where a display region and a peripheral region are formed on the displaypanel, and the peripheral region surrounds the display region; and themethod includes:

forming an array substrate, where the array substrate include pixelcircuits and a second conductive portion, the pixel circuits are locatedin the display region, the second conductive portion is located in theperipheral region, and the second conductive portion is connected withthe pixel circuits;

forming a color filter substrate;

cell-assembling on the array substrate and the color filter substrate,where the pixel circuits and the second conductive portion are locatedon a side of the array substrate facing the color filter substrate; and

forming a first conductive portion on a side surface of the arraysubstrate and a side surface of the color filter substrate, where afirst end of the first conductive portion is located on the side surfaceof the color filter substrate, a second end of the first conductiveportion is located on the side surface of the array substrate, and thefirst conductive portion is connected with the second conductiveportion.

In an embodiment, forming the first conductive portion on the sidesurface of the array substrate and the side surface of the color filtersubstrate includes:

manufacturing the first conductive portion; and

transfer printing the first conductive portion on the side surface ofthe array substrate and the side surface of the color filter substratethrough a transfer printing process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram illustrating a display panelaccording to an embodiment of the present disclosure.

FIG. 2 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 3 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 4 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 5 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 6 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 7 is a schematic structural diagram illustrating another displaypanel according to an embodiment of the present disclosure.

FIG. 8 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 9 is a schematic diagram illustrating an optical path of a displaydevice according to an embodiment of the present disclosure.

FIG. 10 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 11 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 12 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 13 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 14 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 15 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 16 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 17 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 18 is a schematic structural diagram illustrating a display deviceaccording to an embodiment of the present disclosure.

FIG. 19 is a schematic diagram illustrating relationship curves betweenintensities and angles of light emission according to an embodiment ofthe present disclosure.

FIG. 20 is a schematic flowchart illustrating a method of manufacturinga display panel according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

To make the above-mentioned objects, features and advantages of thepresent disclosure more clearly understood, specific embodiments of thepresent disclosure will be described in detail below with reference tothe accompanying drawings.

An embodiment of the present disclosure provides a display panel 1. Asshown in FIG. 1 , the display panel 1 includes a color filter/filmsubstrate 11, an array substrate 12 and a first conductive portion 13. Adisplay region AA and a peripheral region NA are formed on the displaypanel 1, and the peripheral region NA surrounds the display region AA.

In this embodiment, as shown in FIG. 1 , the color filter substrate 11is opposite to the array substrate 12. The array substrate 12 includespixel circuits (not shown) and a second conductive portion 14, where thepixel circuits are located in the display region AA, and the secondconductive portion 14 is located in the peripheral region NA. The secondconductive portion 14 is connected with the pixel circuits, and thepixel circuits and the second conductive portion 14 are located on aside of the array substrate 12 facing the color filter substrate 11.

In this embodiment, as shown in FIG. 1 , the first conductive portion 13is located on a side surface of the array substrate 12 and a sidesurface of the color filter substrate 11. A first end E1 of the firstconductive portion 13 is located on the side surface of the color filtersubstrate 11, a second end E2 of the first conductive portion 13 islocated on the side surface of the array substrate 12, and the firstconductive portion 13 is connected with the second conductive portion14.

In this embodiment, since the first conductive portion 13 is provided onthe side surface of the array substrate 12 and the side surface of thecolor filter substrate 11, and the first conductive portion 13 isconnected with the pixel circuits through the second conductive portion14, the pixel circuits can be connected with a chip for controlling thepixel circuits through the first conductive portion 13. And since thefirst conductive portion 13 is located on the side surface of the arraysubstrate 12 and the side surface of the color filter substrate 11, aspace on the array substrate 12 located in the peripheral region NA canbe avoided from being occupied, and a width of the peripheral region NAcan be reduced, which is beneficial to realizing a narrow bezel andincreasing a screen-to-body ratio. By applying the display panel 1 todisplay devices in a spliced display device, a seam between two adjacentdisplay devices in the spliced display device can be reduced.

The display panel 1 provided by the embodiment of the present disclosurehas been introduced briefly above, and will be introduced in detailbelow.

An embodiment of the present disclosure provides a display panel 1. Asshown in FIG. 1 and FIG. 2 , the display panel 1 includes a displayregion AA and a peripheral region NA, where the peripheral region NAsurrounds the display region AA.

In this embodiment, as shown in FIG. 1 , the display panel 1 furtherincludes a color filter substrate 11, an array substrate 12, a liquidcrystal layer 18, a second conductive portion 14, a first conductiveportion 13, a conductive film layer 15, Chip-on-films (COFs) 16 and aprinted circuit board 17.

As shown in FIG. 1 , the color filter substrate 11 is opposite to thearray substrate 12, and the liquid crystal layer 18 is located betweenthe color filter substrate 11 and the array substrate 12.

In this embodiment, as shown in FIG. 1 , the array substrate 12 includespixel circuits (not shown) and the second conductive portion 14. Thepixel circuits are located in the display region AA, and are configuredto control a deflection angle of liquid crystal molecules in the liquidcrystal layer 18 and thus an intensity of light transmitting through theliquid crystal layer 18. The second conductive portion 14 is located inthe peripheral region NA, and the second conductive portion 14 isconnected with the pixel circuits. The second conductive portion 14 maybe made of metal materials, such as copper, but are not limited thereto.The pixel circuits and the second conductive portion 14 are located on aside of the array substrate 12 facing the color filter substrate 11. Thesecond conductive portion 14 may be manufactured in the process ofmanufacturing the pixel circuits. For example, the second conductiveportion 14 may be formed in a same layer and in one process step assource electrodes or drain electrodes of transistors in the pixelcircuits.

In this embodiment, the pixel circuits can drive pixels to emit lightunder the control of gate driving signals and data driving signals.Generally, the gate driving signals can be provided by gate drivingchips, and the data driving signals can be provided by data drivingchips. Therefore, the display panel 1 further needs to be provided withthe gate driving chips and the data driving chips.

In this embodiment, as shown in FIG. 3 , the display panel 1 may be arectangle, including four sides: two first sides S1 and two second sidesS2, where one of the two first sides S1 is provided with the gatedriving chips, and the other one of the two first sides S1 is providedwith the data driving chips. The two second sides S2 may not be providedwith a gate driving chip or a data driving chip.

In this embodiment, to reduce a width of the peripheral region NA, thegate driving chips and the data driving chips are respectively fixed onflexible circuit boards, and the gate driving chips and the data drivingchips are electrically connected with the pixel circuits through theflexible circuit boards. Then the gate driving chips and the datadriving chips are respectively disposed on a side of the display panel 1away from the pixel circuits by bending the flexible circuit boards. Aflexible circuit board on which a gate driving chip or a data drivingchip is fixed may be referred to as a COF 16. Since a solution ofdisposing the gate driving chips on the side of the display panel 1 awayfrom the pixel circuits is similar to that of disposing the data drivingchips on the side of the display panel 1 away from the pixel circuits,to avoid content redundancy, disposing the gate driving chips on theside of the display panel 1 away from the pixel circuits will be takenas an example below for description.

In this embodiment, as shown in FIG. 4 , a gate driving chip 161 isfixed on a flexible circuit board 162, and a COF 16 is formed after thegate driving chip 161 is fixed on the flexible circuit board 162. FIG. 4is an enlarged schematic diagram of part A in FIG. 3 .

In this embodiment, as shown in FIG. 1 , the first conductive portion 13is located on a side surface of the array substrate 12 and a sidesurface of the color filter substrate 11. A first end E1 of the firstconductive portion 13 is located on the side surface of the color filtersubstrate 11, a second end E2 of the first conductive portion 13 islocated on the side surface of the array substrate 12, and the firstconductive portion 13 is connected with the second conductive portion14. Therefore, the COFs 16 can be electrically connected with the pixelcircuits through the first conductive portion 13 and the secondconductive portion 14.

In this embodiment, as shown in FIG. 1 and FIG. 5 , a distance L betweenthe first end E1 of the first conductive portion 13 and the second endE2 of the first conductive portion 13 is smaller than a distance betweena first surface F1 of the color filter substrate 11 away from the arraysubstrate 12 and a second surface F2 of the array substrate 12 away fromthe color filter substrate 11. That is, a length of the first conductiveportion 13 is smaller than the distance between the first surface F1 andthe second surface F2. FIG. 5 is an enlarged schematic diagram of part Bin FIG. 4 .

In this embodiment, as shown in FIG. 5 , the first conductive portion 13is located between a first central axis J1 of the side surface of thecolor filter substrate 11 and a second central axis J2 of the sidesurface of the array substrate 12. The first central axis J1 and thesecond central axis J2 are respectively perpendicular to a directionfrom the first end E1 of the first conductive portion 13 to the secondend E2 of the first conductive portion 13. That is, the first centralaxis J1 and the second central axis J2 are respectively perpendicular toextension direction of the first conductive portion 13. In this way,uniform electrical contact between the first conductive portion 13 andthe second conductive portion 14 can be ensured.

In this embodiment, as shown in FIG. 5 , a distance between the firstend E1 of the first conductive portion 13 and the first central axis J1is a first distance D1, and a distance between the second end E2 of thefirst conductive portion 13 and the second central axis J2 is a seconddistance D2, where the first distance D1 is equal to the second distanceD2.

In this embodiment, the first conductive portion 13 is made of metalmaterials, such as silver. The first conductive portion 13 and thesecond conductive portion 14 are formed in different process steps. Thefirst conductive portion 13 may be manufactured through a transferprinting process.

In this embodiment, a thickness of the color filter substrate 11 may besubstantially equal to that of the array substrate 12, both being 0.7mm. And the distance L between the first end E1 of the first conductiveportion 13 and the second end E2 of the first conductive portion 13 is0.6 mm, that is, the length of the first conductive portion 13 is 0.6mm. The first distance D1 between the first end E1 of the firstconductive portion 13 and the first central axis J1 is 0.1 mm, and thesecond distance D2 between the second end E2 of the first conductiveportion 13 and the second central axis J2 is 0.1 mm. In this way,uniform electrical contact between the first conductive portion 13 andthe second conductive portion 14 can be ensured.

In this embodiment, as shown in FIG. 1 , the conductive film layer 15 islocated between the first conductive portion 13 and the COFs 16, theCOFs 16 are bound/bonded together with the first conductive portion 13through the conductive film layer 15, and the COFs 16 are electricallyconnected with the first conductive portion 13. That is, the firstconductive portion 13 is in electrical communication with the COFs 16through the conductive film layer 15. The conductive film layer 15 maybe an Anisotropic Conductive Film (ACF), but is not limited thereto.

In this embodiment, as shown in FIG. 5 , there are a plurality of firstconductive portions 13. The conductive film layer 15 may cover all thefirst conductive portions 13. The plurality of first conductive portions13 include a plurality of central conductive portions 131 and aplurality of edge conductive portions 132, where the central conductiveportions 131 are located in middle W1 of the plurality of firstconductive portions 13, and the edge conductive portions 132 are locatedin edges W2 of the plurality of first conductive portions 13. In thisembodiment, the COFs 16 are connected with the plurality of centralconductive portions 131 through the conductive film layer 15. There maybe 15 edge conductive portions 132 on both sides of the plurality ofcentral conductive portions 131 respectively, but are not limitedthereto. The conductive film layer 15 may be coated with a boundary ofthe edge conductive portions 132 away from the central conductiveportions 131 as reference. Thus, it can be avoided that a part of thecentral conductive portions 131, which play a conductive role, are notcovered by the conductive film layer 15 and thus fail to play theconductive role.

In this embodiment, as shown in FIG. 6 , a conductive portion 163 of theCOF 16 is electrically connected with a corresponding first conductiveportion 13. It should be noted that, at the edges W2 of the plurality offirst conductive portions 13, there may exist a situation where a partof the first conductive portions 13 (edge conductive portions 132) aremissing, but this does not affect electrical connection between the COFs16 and the pixel circuits.

In this embodiment, when the COF 16 is bound/bonded to the firstconductive portions 13, in the direction from the first end E1 of thefirst conductive portion 13 to the second end E2 of the first conductiveportion 13, the binding can be performed in such a manner that theconductive portion 163 of the COF 16 exceeds the second end E2 of thefirst conductive portion 13 by a specified distance, so as to ensurethat the conductive portion 163 of the COF 16 can be electricallyconnected with the corresponding first conductive portion 13 with aprocess error inclusive. The specified distance may be 0.1 mm, but isnot limited thereto.

In this embodiment, as shown in FIG. 1 and FIG. 4 , the printed circuitboard 17 is located on a side of the COF 16 away from the arraysubstrate 12, and is connected with the COF 16. A control chip may bebound/bonded on the printed circuit board 17, and the control chip iselectrically connected with the gate driving chip on the COF 16 throughthe printed circuit board 17. The control chip is configured to controlthe gate driving chip.

In this embodiment, as shown in FIG. 4 , a width of part of the COF 16located close to the printed circuit board 17 is smaller than a width ofpart of the COF 16 located close to the array substrate 12. Thus, alarger assembly space can be reserved for a protection plate 89configured to protect the printed circuit board 17, so as to ensure afixing strength of the protection plate 89. The protection plate 89 canbe attached to other nearby structures through screws. For example, theprotection plate 89 can be attached to a middle frame 82 in a lightemitting module through screws.

In this embodiment, as shown in FIG. 7 , the display panel 1 furtherincludes a first polarizer 71, a second polarizer 72, a first lightshielding layer (not shown), a second light shielding layer (not shown),a first water and oxygen barrier layer (not shown), and a second waterand oxygen barrier layer (not shown).

In this embodiment, as shown in FIG. 7 , the first polarizer 71 islocated on a side of the color filter substrate 11 away from the arraysubstrate 12, and the second polarizer 72 is located on a side of thearray substrate 12 away from the color filter substrate 11. The firstpolarizer 71 and the second polarizer 72 are configured to eliminate aninfluence of ambient light on display pictures. That is, a polarizer isrespectively attached to a light emitting side of the color filtersubstrate 11 and a light incident side of the array substrate 12.

In this embodiment, as shown in FIG. 7 , the color filter substrate 11includes a first edge G1 and a second edge G2, where the first edge G1is located on a first side S1 of the color filter substrate 11, and thesecond edge G2 is located on a second side S2 of the color filtersubstrate 11. The second side S2 is a side other than the first side S1,and the first conductive portion 13 is located on the first side S1 ofthe color filter substrate 11.

In this embodiment, a distance between a third edge G3 of the firstpolarizer 71 located on the first side S1 and the first edge G1 is0.05˜1.7 mm, for example, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.9 mm, 1.5mm or 1.7 mm. The third edge G3 is parallel to the first edge G1. Adistance between a fourth edge G4 of the first polarizer 71 located onthe second side S2 and the second edge G2 is 0˜0.1 mm, for example, 0mm, 0.5 mm or 0.1 mm. The fourth edge G4 is parallel to the second edgeG2.

In this embodiment, as shown in FIG. 7 , the array substrate 12 includesa fifth edge G5 and a sixth edge G6, where the fifth edge G5 is locatedon the first side S1 of the array substrate 12, and the sixth edge G6 islocated on the second side S2 of the array substrate 12.

In this embodiment, a distance between a seventh edge G7 of the secondpolarizer 72 located on the first side S1 and the fifth edge G5 is0.1˜1.7 mm, for example, 0.1 mm, 0.3 mm, 0.4 mm, 0.9 mm, 1.5 mm or 1.7mm. The seventh edge G7 is parallel to the fifth edge G5. A distancebetween an eighth edge G8 of the second polarizer 72 located on thesecond side S2 and the sixth edge G6 is 0˜0.1 mm, for example, 0 mm,0.05 mm or 0.1 mm. The eighth edge G8 is parallel to the sixth edge G6.A distance between an edge of each of the above polarizers and an edgeof the display panel is not greater than a width of a non-display regionin the display panel.

In this embodiment, the color filter substrate 11 includes a first edgeregion and a first central region, where the first edge region surroundsthe first central region, and a projection of the first polarizer 71 onthe color filter substrate 11 is located within the first centralregion. The first light shielding layer is located on a side of thecolor filter substrate 11 facing the first polarizer 71, and the firstlight shielding layer is located in the first edge region and coversside surfaces of the first polarizer 71. The first light shielding layermay be made of light shielding ink, but is not limited thereto. Thefirst light shielding layer is configured to avoid light emitted by alight emitting module from leaking out of the third edge G3 and thefourth edge G4 of the first polarizer 71 to affect a quality of displaypictures.

In this embodiment, the first water and oxygen barrier layer covers thefirst light shielding layer. The first water and oxygen barrier layermay be made of a fluorinating agent, but is not limited thereto. Thefirst water and oxygen barrier layer is configured to block water andoxygen and protect the first polarizer 71, so as to avoid failure ofmicroscopic regions of cut edges due to water vapor entering edges ofthe first polarizer 71.

In this embodiment, the array substrate 12 includes a second edge regionand a second central region, where the second edge region surrounds thesecond central region, and a projection of the second polarizer 72 onthe array substrate 12 is located within the second central region. Thesecond light shielding layer is located on a side of the array substrate12 facing the second polarizer 72, and the second light shielding layeris located in the second edge region, and covers side surfaces of thesecond polarizer 72. The second light shielding layer may be made oflight shielding ink, but is not limited thereto. The second lightshielding layer is configured to avoid light emitted by a light emittingmodule from leaking out of the seventh edge G7 and the eighth edge G8 ofthe second polarizer 72 to affect a quality of display pictures.

In this embodiment, the second water and oxygen barrier layer covers thesecond light shielding layer. The second water and oxygen barrier layermay be made of a fluorinating agent, but is not limited thereto. Thesecond water and oxygen barrier layer is configured to block water andoxygen and protect the second polarizer 72, so as to avoid failure ofmicroscopic regions of cut edges due to water vapor entering edges ofthe second polarizer 72.

In this embodiment, in high-temperature and high-humidity reliabilitytests, failure and light leakage problems caused by water vapor enteringedges of the first polarizer 71 and the second polarizer 72 and a lightleakage problem caused by shrinkage of the first polarizer 71 and thesecond polarizer 72 at the high temperature can be reduced.

In this embodiment, as shown in FIG. 2 , the display panel 1 furtherincludes an alignment mark 21, and the alignment mark 21 is located inthe display region AA. For example, a projection of the alignment mark21 on the array substrate 12 may be located within projection ofsub-pixel in a first row and a second column on the array substrate 12,but is not limited thereto. Since the alignment mark 21 does not occupya space of the peripheral region NA, it is beneficial to reducing awidth of the peripheral region NA and increasing a screen-to-body ratio.

In this embodiment, as shown in FIG. 2 , the peripheral region NAincludes a first sub-region Q1 and a second sub-region Q2, where thefirst sub-region Q1 is located between the display region AA and thefirst conductive portion 13, and the second sub-region Q2 is a regionother than the first sub-region Q1 in the peripheral region NA.

In this embodiment, the color filter substrate 11 includes a third lightshielding layer and a fourth light shielding layer. The third lightshielding layer and the fourth light shielding layer may be blackmatrices in a same layer as a color filter/film (CF). A projection ofthe third light shielding layer on the array substrate 12 is locatedwithin the first sub-region Q1, and a projection of the fourth lightshielding layer on the array substrate 12 is located within the secondsub-region Q2.

In this embodiment, a width of the third light shielding layer is0.6˜1.0 mm, for example, 0.6 mm, 0.8 mm or 1.0 mm, and a width of thefourth light shielding layer is 0.25˜0.5 mm, for example, 0.25 mm, 0.4mm or 0.5 mm.

In this embodiment, since the first conductive portion 13 is provided onthe side surface of the array substrate 12 and the side surface of thecolor filter substrate 11, and the first conductive portion 13 isconnected with the pixel circuits through the second conductive portion14, the pixel circuits can be connected with a chip for controlling thepixel circuits through the first conductive portion 13. And since thefirst conductive portion 13 is located on the side surface of the arraysubstrate 12 and the side surface of the color filter substrate 11, aspace on the array substrate 12 located in the peripheral region NA canbe avoided from being occupied, and a width of the peripheral region NAcan be reduced, which is beneficial to realizing a narrow bezel andincreasing a screen-to-body ratio. Furthermore, the width of theperipheral region NA can be reduced to less than 1 mm. By applying thedisplay panel 1 to display devices in a spliced display device, a seambetween two adjacent display devices in the spliced display device canbe reduced.

An embodiment of the present disclosure provides a display device. Asshown in FIG. 8 and FIG. 9 , the display device includes the displaypanel 1 described above and a light emitting module 8. FIG. 8 is across-sectional view of the display device on the first side S1, andFIG. 9 is a cross-sectional view of the display device on the secondside S2.

In this embodiment, the display panel 1 is located on a light emittingside of the light emitting module 8, and the array substrate 12 islocated between the color filter substrate 11 and the light emittingmodule 8.

In this embodiment, as shown in FIG. 8 and FIG. 9 , the light emittingmodule 8 includes a back plate 81, the middle frame 82, an optical filmlayer 83, a light plate 84, a first reflective film layer 85, a thirdreflective film layer 86, a second fastener 88, the protection plate 89and a support block 810.

In this embodiment, as shown in FIG. 8 and FIG. 9 , the back plate 81includes a bottom plate 811 and a side wall 812. The light plate 84 islocated on a side of the bottom plate 811 facing the display panel 1,and includes a plurality of light sources 841. The middle frame 82 isdisposed around the plurality of light sources 841, and is fixedlyconnected with the side wall 812. The middle frame 82 is located betweenthe bottom plate 811 and the optical film layer 83.

In this embodiment, as shown in FIG. 10 and FIG. 11 , a projection ofthe optical film layer 83 on the color filter substrate 11 is locatedwithin a projection of the array substrate 12 on the color filtersubstrate 11, and a projection of the middle frame 82 on the arraysubstrate 12 is located within a projection of the optical film layer 83on the array substrate 12. FIG. 10 is an enlarged schematic diagram ofpart C1 in FIG. 8 . FIG. 11 is an enlarged schematic diagram of part C2in FIG. 9 .

In this embodiment, as shown in FIG. 8 to FIG. 10 , the display devicefurther includes a fifth light shielding layer 1001 and a metal layer1002.

In this embodiment, the fifth light shielding layer 1001 is located on aside surface of the color filter substrate 11 and a side surface of thearray substrate 12. The fifth light shielding layer 1001 may be made ofa black UV curable adhesive, but is not limited thereto. The fifth lightshielding layer 1001 is configured to avoid light from leaking out ofthe side surface of the color filter substrate 11 and the side surfaceof the array substrate 12.

In this embodiment, as shown in FIG. 8 to FIG. 10 , the metal layer 1002covers the fifth light shielding layer 1001, and is located on a sidesurface of the light emitting module 8. A first end of the metal layer1002 is located on a side of the first polarizer 71 away from the colorfilter substrate 11, and is located in a peripheral region NA. A secondend of the metal layer 1002 is located on a side of the light emittingmodule 8 away from the display panel 1. The metal layer 1002 isconfigured to shield light and prevent electromagnetic interference. Themetal layer 1002 may be made of aluminum, but is not limited thereto.

In this embodiment, the metal layer 1002 may be a black aluminum foiltape. Since the first end of the metal layer 1002 is attached to theside of the first polarizer 71 away from the color filter substrate 11,and is located in the peripheral region NA, it can be ensured that themetal layer 1002 will not be unglued in a high-temperature andhigh-humidity environment.

In this embodiment, as shown in FIG. 10 , on the first side S1 of theoptical film layer 83, in a first direction X, a distance between anedge of the optical film layer 83 and the metal layer 1002 is a thirddistance D3, and a distance between the middle frame 82 and the edge ofthe optical film layer 83 is a fourth distance D4. The first direction Xis parallel to a surface of the optical film layer 83 facing the displaypanel 1. The third distance D3 may be equal to the fourth distance D4.The third distance D3 is 0.3˜0.5 mm. For example, the third distance D3may be 0.3 mm, 0.4 mm or 0.5 mm. Thus, a space can be reserved forexpansion of the light emitting module in a high-temperature andhigh-humidity environment, so as to avoid the metal layer 1002 frombeing unglued.

In this embodiment, as shown in FIG. 11 , on the second side S2 of theoptical film layer 83, in the first direction X, a distance between anedge of the optical film layer 83 and the metal layer 1002 is a fifthdistance D5, and a distance between the middle frame 82 and the edge ofthe optical film layer 83 is a sixth distance D6. The sixth distance D6may be greater than or equal to the fifth distance D5. The fifthdistance D5 is 0.1˜0.3 mm. For example, the fifth distance D5 is 0.1 mm,0.2 mm or 0.3 mm. The sixth distance D6 is 0.3˜0.5 mm. For example, thesixth distance D6 may be 0.3 mm, 0.4 mm or 0.5 mm. Thus, a space can bereserved for expansion of the light emitting module in ahigh-temperature and high-humidity environment, so as to avoid the metallayer 1002 from being unglued.

It should be noted that a projection of the optical film layer 83 on thearray substrate 12 covers the display region AA and a part of theperipheral region NA.

In this embodiment, as shown in FIG. 8 , on the first side S1 of thebottom plate 811, the middle frame 82 includes a first side surface K1and a second side surface K2, where the first side surface K1 isconnected with the second side surface K2. The first side surface K1 isan inclined plane. The first side surface K1 is inclined from theperipheral region NA to the display region AA. The second side surfaceK2 extends along a second direction Z, where the second direction Z isperpendicular to a surface of the optical film layer 83 facing thedisplay panel 1.

In this embodiment, as shown in FIG. 8 , a COF 16 is attached on thefirst side surface K1 and the second side surface K2, where a gatedriving chip 161 is located at a connection between the first sidesurface K1 and the second side surface K2, and a flexible circuit board162 is attached to the first side surface K1 and the second side surfaceK2. An acute angle between the first side surface K1 and the seconddirection Z is greater than an acute angle between the COF 16 and thesecond direction Z.

In this embodiment, as shown in FIG. 8 , a printed circuit board 17 islocated on a side of the COFs 16 away from the array substrate 12, andis connected with the COFs 16.

In this embodiment, as shown in FIG. 8 , on the first side S1 of thebottom plate 811, the side wall 812 of the back plate 81 includes afirst vertical extension portion H1, a first horizontal extensionportion H2 and a second vertical extension portion H3. The firstvertical extension portion H1 is connected with the bottom plate 811 ofthe back plate 81, and extends along the second direction Z. The firsthorizontal extension portion H2 is located between the first verticalextension portion H1 and the second vertical extension portion H3. Anextension direction of the first horizontal extension portion H2 isperpendicular to the second direction Z, that is, the first horizontalextension portion H2 extends along the first direction X, and the firsthorizontal extension portion H2 extends in a direction from the displayregion AA to the peripheral region NA. The second vertical extensionportion H3 extends along the second direction Z. The first horizontalextension portion H2 cooperates with the protection plate 89 to providea placement space for the printed circuit board 17.

In this embodiment, as shown in FIG. 8 , the support block 810 islocated at a connection between the first vertical extension portion H1and the first horizontal extension portion H2, and the support block 810is located between the first vertical extension portion H1 and theprinted circuit board 17 for supporting the printed circuit board 17.The support block 810 may be made of rigid foam for supporting theprinted circuit board 17 and playing a buffer role.

In this embodiment, as shown in FIG. 8 , the protection plate 89 islocated on a side of the printed circuit board 17 away from the supportblock 810 for protecting the printed circuit board 17. The protectionplate 89, the middle frame 82 and the back plate 81 are fixed together.

In this embodiment, as shown in FIG. 8 , the protection plate 89includes a first protection portion 891 and a second protection portion892, where the first protection portion 891 is connected with the secondprotection portion 892. The first protection portion 891 extends alongthe second direction Z. The printed circuit board 17 is located betweenthe first protection portion 891 and the support block 810. An extensiondirection of the second protection portion 892 is perpendicular to thesecond direction Z, that is, the second protection portion 892 extendsalong the first direction X. The second protection portion 892 islocated on a side of the printed circuit board 17 away from the displaypanel 1.

In this embodiment, as shown in FIG. 8 , the middle frame 82 includes afirst support portion 821, a second support portion 822 and a thirdsupport portion 823. The second support portion 822 is located betweenthe first support portion 821 and the third support portion 823. Thefirst support portion 821 is located on the bottom plate 811. Anextension direction of the first support portion 821 is perpendicular tothe second direction Z, that is, the first support portion 821 extendsalong the first direction X. The second support portion 822 extendsalong the second direction Z. The third support portion 823 isconfigured to support the optical film layer 83.

In this embodiment, a first fastener passes through the second verticalextension portion H3, the third support portion 823 and the firstprotection portion 891, and fixes the second vertical extension portionH3, the third support portion 823 and the first protection portion 891together, so as to fix the back plate 81, the middle frame 82 and theprotection plate 89 together. The first fastener may be a screw, but isnot limited thereto.

In this embodiment, as shown in FIG. 8 , a first support point of thethird support portion 823 to the optical film layer 83, a second supportpoint of the second support portion 822 to the third support portion823, and a contact point between the third support portion 823 and thefirst fastener are vertexes of a mechanical triangle 91. That is, thefirst support point, the second support point, and the contact pointbetween the third support portion 823 and the first fastener form amechanical triangle relationship, so as to ensure an overall strengthand an architecture stability.

In this embodiment, as shown in FIG. 9 , on the second side S2 of thebottom plate 811, a side surface K7 of the middle frame 82 adjacent tothe metal layer 1002 is a plane, and extends along the second directionZ. The side wall 812 of the back plate 81 and the middle frame 82 arefixed together through the second fastener 88, where the second fastener88 may be a screw.

In this embodiment, as shown in FIG. 12 , the third support portion 823includes a third side surface K3, a fourth side surface K4 and a fifthside surface K5, where the third side surface K3, the fourth sidesurface K4 and the fifth side surface K5 face the optical film layer 83.The fourth side surface K4 is located between the third side surface K3and the fifth side surface K5. The third side surface K3 is a plane forsupporting the optical film layer 83, and extends along the firstdirection X. An angle between the fourth side surface K4 and a surfaceof the optical film layer 83 facing the middle frame 82 is an acuteangle. The fifth side surface K5 is a convex arc surface.

In this embodiment, a width of the third side surface K3 in the firstdirection X is 0.2˜0.3 mm, for example, 0.2 mm, 0.25 mm or 0.3 mm. Inthis way, when the middle frame 82 is attached with the optical filmlayer 83, an effective width of an adhesive bearing surface for oneattachment can be ensured.

In this embodiment, the angle between the fourth side surface K4 and thesurface of the optical film layer 83 facing the middle frame 82 is 23˜33degrees, for example, 23 degrees, 30 degrees or 33 degrees.

In this embodiment, a radius of a sphere where the convex arc surface islocated is 10˜15 mm, for example, 10 mm, 12.5 mm or 15 mm.

In this embodiment, as shown in FIG. 12 , the second support portion 822includes a sixth side surface K6, where the sixth side surface K6 islocated on a side of the second support portion 822 facing the opticalfilm layer 83. The sixth side surface K6 is a plane. A length of thesixth side surface K6 in the second direction Z is 14.5 mm, but is notlimited thereto.

In this embodiment, a rounded transition between the third side surfaceK3 of the middle frame 82 facing the optical film layer 83 and the fifthside surface K5 is achieved through the fourth side surface K4, whichcan ensure uniform light transition and avoid generation of brightlines.

In this embodiment, a distance between a surface of the light plate 84facing the optical film layer 83 and a surface of the optical film layer83 facing the light plate 84 is 30 mm, but is not limited thereto.

In this embodiment, as shown in FIG. 10 and FIG. 11 , the display devicefurther includes a first adhesive layer 1003 and a second adhesive layer1004.

In this embodiment, as shown in FIG. 10 and FIG. 11 , the first adhesivelayer 1003 is located between the middle frame 82 and the optical filmlayer 83, and a thickness of the first adhesive layer 1003 is 0.15˜0.25mm, for example, 0.15 mm, 0.20 mm or 0.25 mm. The first adhesive layer1003 may be made of a water adhesive, for example, a hot melt adhesiveor an optical curable adhesive, but are not limited thereto. Forexample, a top end surface of the middle frame 82 may be coated with thehot melt adhesive for fixing an edge of the optical film layer 83 to thetop end surface of the middle frame 82, where the third side surface K3is the top end surface of the middle frame 82. The hot melt adhesive orthe optical curable adhesive includes a resin material, and atransmittance of the hot melt adhesive or the optical curable adhesiveis 80%˜99.5%, for example, 80%, 90%, 95% or 99.5%, but is not limitedthereto.

In this embodiment, as shown in FIG. 10 and FIG. 11 , the secondadhesive layer 1004 is located between the optical film layer 83 and thedisplay panel 1, and a thickness of the second adhesive layer 1004 is0.1˜0.2 mm, for example, 0.1 mm, 0.15 mm or 0.2 mm. The second adhesivelayer 1004 may be made of a water adhesive, for example, an opticalcurable adhesive. That is, an edge of a second polarizer 72 is coatedwith the optical curable adhesive. Since the second polarizer 72 isfixed on the array substrate 12, and the array substrate 12 and thecolor filter substrate 11 are fixed together, the optical curableadhesive is used to fix the array substrate 12 and the color filtersubstrate 11 on the optical film layer 83. The optical curable adhesiveincludes a resin material, and a transmittance of the optical curableadhesive is 80%˜99.5%, for example, 80%, 90%, 95% or 99.5%, but is notlimited thereto. The optical curable adhesive may be a UV curableadhesive, but is not limited thereto.

In this embodiment, during manufacturing of the first adhesive layer1003, an adhesive coating speed of an adhesive coating machine can beset to 40˜50 mm/s, an adhesive coating width can be set to 0.6˜0.8 mm,and an adhesive coating thickness can be set to 0.2˜0.4 mm. For example,the adhesive coating speed of the adhesive coating machine may be set to40 mm/s, 45 mm/s or 50 mm/s, the adhesive coating width may be set to0.6 mm, 0.7 mm or 0.8 mm, and the adhesive coating thickness may be setto 0.2 mm, 0.3 mm or 0.4 mm.

In this embodiment, during manufacturing of the second adhesive layer1004, the adhesive coating speed of the adhesive coating machine can beset to 60˜80 mm/s, the adhesive coating width can be set to 0.6˜0.8 mm,and the adhesive coating thickness can be set to 0.2˜0.3 mm. Forexample, the adhesive coating speed of the adhesive coating machine maybe set to 60 mm/s, 70 mm/s or 80 mm/s, the adhesive coating width may beset to 0.6 mm, 0.65 mm, 0.7 mm or 0.8 mm, and the adhesive coatingthickness may be set to 0.2 mm, 0.3 mm or 0.4 mm.

In this embodiment, the display panel 1, the optical film layer 83, andthe middle frame 82 can be assembled and fixed in a manner of wateradhesive attachment through automation equipment (adhesive coatingmachine).

In this embodiment, the optical film layer 83 may include a lighttransmitting glass plate, a light diffusing film and a brightnessenhancement film, where the light diffusing film is located on a side ofthe light transmitting glass plate away from the array substrate 12, andthe brightness enhancement film is located on a side of the lighttransmitting glass plate facing the array substrate 12. A side of thelight diffusing film and the top end surface of the middle frame 82 areadhesively fixed through the hot melt adhesive. The brightnessenhancement film and the light diffusing film may be formed directly onboth sides of the light transmitting glass plate in a manner of coating,or the brightness enhancement film and the light diffusing film may beformed separately, and then the brightness enhancement film and thelight diffusing film can be respectively fixed or adhered to both sidesof the light transmitting glass plate.

In this embodiment, as shown in FIG. 8 , FIG. 9 and FIG. 12 , the firstreflective film layer 85 is located on a surface of the middle frame 82facing the optical film layer 83. The first reflective film layer 85covers the fifth side surface K5, a part of the fourth side surface K4and a part of the sixth side surface of the middle frame 82. The firstreflective film layer 85 may be a reflective sticker, which can reduce acost. In an embodiment, the first reflective film layer 85 may be awhite film layer manufactured by a paint baking process.

In this embodiment, the reflective sticker is made of a compositematerial, and the reflective sticker includes a reflective materiallayer and a transparent diffusion layer, where the reflective materiallayer is close to the middle frame 82, and the transparent diffusionlayer is far away from the middle frame 82. A reflectance of thereflective material layer is 75%, but is not limited thereto.

In this embodiment, as shown in FIG. 8 , FIG. 9 , FIG. 12 and FIG. 13 ,on a side of the middle frame 82 close to the optical film layer 83,there exists a gap between the first reflective film layer 85 and thethird side surface K3. Thus, it can be avoided a phenomenon that edgesof a picture are bright due to reduction in a stroke of light close tothe optical film layer 83 after reflection.

In this embodiment, as shown in FIG. 13 , on the side of the middleframe 82 close to the optical film layer 83, a distance D7 between thefirst reflective film layer 85 and the third side surface K3 is 2.5 to 5mm, for example, 2.5 mm, 3 mm or 5 mm.

In this embodiment, as shown in FIG. 8 , FIG. 9 , FIG. 12 and FIG. 13 ,on a side of the middle frame 82 close to the bottom plate 811, thereexists a gap between the first reflective film layer 85 and the firstsupport portion 821. Thus, it is convenient to paste the reflectivesticker on the middle frame 82, and wrinkling on a side of thereflective sticker close to the bottom plate 811 can be avoided.

In this embodiment, as shown in FIG. 13 , on the side of the middleframe 82 close to the bottom plate 811, a distance D8 between the firstreflective film layer 85 and the first support portion 821 is less thanor equal to 2 mm, for example, 0.5 mm, 1 mm or 2 mm.

In this embodiment, there are four middle frames 82. Every two of thefour middle frames 82 are adjacent to each other, and the four middleframes 82 enclose a quadrilateral, for example, a rectangle. Twoadjacent middle frames 82 are fixedly connected with each other.

In this embodiment, as shown in FIG. 14 , the light emitting module 8further includes an embedded corner block 1401, where the embeddedcorner block 1401 is configured to fixedly connect two adjacent middleframes 82. Therefore, in this embodiment, the light emitting module 8may include four embedded corner blocks 1401.

In this embodiment, as shown in FIG. 15 , the embedded corner block 1401includes a first connection portion P1 and a second connection portionP2, where the first connection portion P1 is connected with the secondconnection portion P2, and an extension direction of the firstconnection portion P1 intersects with an extension direction of thesecond connection portion P2. The first connection portion P1 is fixedlyconnected with one of two adjacent middle frames 82, and the secondconnection portion P2 is fixedly connected with the other one of the twoadjacent middle frames 82.

In this embodiment, one of two adjacent middle frames 82 includes afirst positioning hole, and the other one of the two adjacent middleframes 82 includes a second positioning hole. In this embodiment, asshown in FIG. 15 , the first connection portion P1 includes a firstpositioning column P11, and the second connection portion P2 includes asecond positioning column P21. The first positioning column P11 islocated in the first positioning hole, and the second positioning columnP21 is located in the second positioning hole. Thus, by using thepositioning columns to cooperate with the positioning holes, precisepositioning can be performed during assembly of middle frames 82.

In this embodiment, as shown in FIG. 15 , the first connection portionP1 includes a first screw hole P12, and the second connection portion P2includes a second screw hole P22. In this way, two countersunk guidescrews can be used to lock one embedded corner block 1401 and two middleframes 82 together through the first screw hole P12 and the second screwhole P22 respectively. Therefore, it can be ensured that a gap betweeninner surfaces of a corner after two adjacent middle frames 82 areconnected is smaller than 0.1 mm.

In this embodiment, one of two adjacent middle frames 82 includes afirst groove, and the other one of the two adjacent middle frames 82includes a second groove. The first connection portion P1 is located inthe first groove, and a depth of the first groove is the same as athickness of the first connection portion P1. The second connectionportion P2 is located in the second groove, and a depth of the secondgroove is the same as a thickness of the second connection portion P2.In this way, when the two adjacent middle frames 82 are fixedlyconnected with each other through the embedded corner block 1401,surfaces of the embedded corner block 1401 away from the middle frames82 are substantially flush with surfaces of the middle frames 82 exceptthe first groove and the second groove, so that inner walls of themiddle frames 82 can be kept as smooth as possible to avoid affecting auniformity of light emitted from the light emitting module 8.

In this embodiment, as shown in FIG. 14 , there exists an opening 1402on a side close to the bottom plate 811 between two adjacent middleframes 82. The opening 1402 can be acquired by cutting bottom edges oftwo adjacent middle frames 82 on the side close to the bottom plate 811.Since there exists the opening 1402 on the side close to the bottomplate 811 between two adjacent middle frames 82, it can be avoided thatfluctuations in a size of the middle frames 82 on the side close to thebottom plate 811 affect an assembly gap of optical reflective surfaces.

In this embodiment, as shown in FIG. 16 , the light emitting module 8further includes a second reflective film layer 1601, where the secondreflective film layer 1601 is located at a connection between twoadjacent middle frames 82, and a width of the second reflective filmlayer 1601 increases in a direction from the optical film layer 83 tothe bottom plate 811. Thus, it can be avoided a phenomenon that a lightintensity of the light emitting module 8 at the connection between twoadjacent middle frames 82 is weaker, and a uniformity of light emissioncan be improved.

In this embodiment, as shown in FIG. 9 , the third reflective film layer86 is located on a side of the light plate 84 facing the optical filmlayer 83 for reflecting light emitted from the light sources 841 towardthe third reflective film layer 86 to the optical film layer 83, so thata light efficiency is improved. The third reflective film layer 86 islocated between the light plate 84 and the middle frame 82, that is, thethird reflective film layer 86 is pressed on a bottom end of the firstsupport portion 821. The middle frame 82 can serve to fix the thirdreflective film layer 86, so as to avoid the third reflective film layer86 from warping due to heat generated when the light sources 841 emitlight, thereby avoiding non-uniform reflected light caused by thewarpage and influence on the light efficiency.

In this embodiment, as shown in FIG. 17 , a plurality of light sources841 are arranged in an array. In this embodiment, a light source 841array formed by the plurality of light sources 841 is symmetrical. FIG.17 shows a part of light sources 841 in the light source 841 array.

In this embodiment, as shown in FIG. 17 , the light source 841 arrayincludes M rows of light sources 841 arranged along the first directionX, and N rows of light sources 841 arranged along a third direction Y,where M and N are integers greater than 6 respectively, and the firstdirection X intersects with the third direction Y That is, in the firstdirection X, each row of light sources 841 includes N light sources 841,and in the third direction Y, each row of light sources 841 includes Mlight sources 841. In the first direction X, each row of light sources841 may be located on a same light bar 1701. In this embodiment, M is 8,and N is 14.

In this embodiment, as shown in FIG. 17 , in the first direction X, alight distance between a first light source 841 and a second lightsource 841 is a first light distance R1, a light distance between thesecond light source 841 and a third light source 841 is a second lightdistance R2, a light distance between an (N−2)^(th) light source 841 andan (N−1)^(th) light source 841 is the second light distance R2, a lightdistance between the (N−1)^(th) light source 841 and an N^(h) lightsource 841 is the first light distance R1, and a light distance betweentwo adjacent light sources 841 in remaining light sources 841 is a thirdlight distance R3. The second light distance R2 is greater than thethird light distance R3, and the third light distance R3 is greater thanthe first light distance R1. The first light distance R1 may be 60 mm,the second light distance R2 may be 85 mm, and the third light distanceR3 may be 75 mm, but they are not limited thereto.

Since, in the first direction X, the first light source 841 and theN^(h) light source 841 are closely adjacent to the middle frame 82, anda surface of the middle frame 82 facing the light sources 841 is areflective surface, an intensity of light emission at positionscorresponding to the first light source 841 and the N^(h) light source841 on the light emitting module 8 may be caused to be smaller. Byshortening the light distance between the second light source 841 andthe first light source 841 and the light distance between the (N−1)^(th)light source 841 and the N^(h) light source 841, the intensity of lightemission at positions corresponding to the first light source 841 andthe N^(h) light source 841 on the light emitting module 8 and theuniformity of light emitted from the light emitting module 8 can beimproved.

Furthermore, since light reflected from the reflective surface of themiddle frame 82 may fall at positions corresponding to the second lightsource 841 and the (N−1)^(th) light source 841 on the light emittingmodule 8, a light intensity at the positions corresponding to the secondlight source 841 and the (N−1)^(th) light source 841 on the lightemitting module 8 is enhanced. By increasing the light distance betweenthe second light source 841 and the third light source 841 and the lightdistance between the (N−2)^(th) light source 841 and the (N−1)^(th)light source 841, the light intensity at the positions corresponding tothe second light source 841 and the (N−1)^(th) light source 841 on thelight emitting module 8 can be reduced, and the uniformity of lightemitted from the light emitting module 8 can be improved.

In this embodiment, as shown in FIG. 17 , in the third direction Y, alight distance between a first light source 841 and a second lightsource 841 is a fourth light distance R4, a light distance between thesecond light source 841 and a third light source 841 is a fifth lightdistance R5, a light distance between an (N−2)^(th) light source 841 andan (N−1)^(th) light source 841 is the fifth light distance R5, a lightdistance between the (N−1)^(th) light source 841 and an N^(th) lightsource 841 is the fourth light distance R4, and a light distance betweentwo adjacent light sources 841 in remaining light sources 841 is thethird light distance R3. The fifth light distance R5 is greater than thethird light distance R3, and the third light distance R3 is greater thanthe fourth light distance R4. The fourth light distance R4 is 62.5 mm,and the fifth light distance R5 is 82 mm, but they are not limitedthereto. Similarly, in the third direction Y, non-equidistantarrangement of the light sources 841 can improve the uniformity of lightemitted from the light emitting module 8.

In this embodiment, as shown in FIG. 18 , in any one of the firstdirection X and the third direction Y, a distance between a side of thefirst reflective film layer 85 on the second support portion 822 facingthe optical film layer 83 and a light source 841 adjacent to the secondsupport portion 822 is a seventh distance Da, and a distance between theside of the first reflective film layer 85 on the second support portion822 facing the optical film layer 83 and an edge of the optical filmlayer 83 close to the middle frame 82 is an eighth distance Db. Aprojection of a surface of the second support portion 822 facing theoptical film layer 83 on the optical film layer 83 is a projection pointDot. An acute angle between the second direction Z and a line betweenthe light source 841 adjacent to the second support portion 822 and theprojection point Dot is a first angle ∠1. An acute angle between thesecond direction Z and a line between the light source 841 adjacent tothe second support portion 822 and a connection point of the secondsupport portion 822 and the third support portion 823 is a second angle∠2. A reflectance of a surface of the third support portion 823 facingthe optical film layer 83, a luminous flux per unit angle of the lightsource 841 at different angles of light emission, the seventh distanceDa, the eighth distance Db, the first angle ∠1 and the second angle ∠2satisfy the following relationship:

$\begin{matrix}{\frac{a}{b} \approx \frac{\int_{0}^{\alpha}{xdr}}{\int_{\alpha}^{\beta}{fxdr}}} & (1)\end{matrix}$

Where a is a value of the seventh distance Da, b is a value of theeighth distance Db, α is a value of the first angle ∠1, β is a value ofthe second angle ∠2, x is the luminous flux per unit angle of the lightsource 841 at different angles of light emission, and r is an angle oflight emission.

In this embodiment, as shown in FIG. 19 , intensities of light emittedfrom the light sources 841 attenuate with angles of light emission. FIG.19 shows a relationship curve 1901 between intensities and angles oflight emitted from the light sources 841 in a polar coordinate system onits left side. FIG. 19 shows a relationship curve 1902 betweenintensities and angles of light emitted from the light sources 841 in arectangular coordinate system on its right side. A horizontal axis inthe polar coordinate system represents an intensity of light emission,and its unit is degree. A horizontal axis in the rectangular coordinatesystem represents an angle of light emission, and its unit is degree; avertical axis in the rectangular coordinate system represents anintensity of light emission, and its unit is 1. According to therelationship curve 1901/1902 between the intensities and the angles oflight emission, luminous fluxes per unit angle of the light sources 841at different angles of light emission can be determined.

In this embodiment, the above relationship formula (1) and therelationship curve 1901/1902 between intensities and angles of lightemission can be used to determine the value of the seventh distance Da.The value of the seventh distance Da may be 15˜20 mm, for example, 15mm, 18 mm or 20 mm.

It should be noted that the value of the seventh distance Da can beacquired by an experimental method, and is not limited to the abovemethod.

In this embodiment, since the first conductive portion 13 is provided onthe side surface of the array substrate 12 and the side surface of thecolor filter substrate 11, and the first conductive portion 13 isconnected with the pixel circuits through the second conductive portion14, the pixel circuits can be connected with a chip for controlling thepixel circuits through the first conductive portion 13. And since thefirst conductive portion 13 is located on the side surface of the arraysubstrate 12 and the side surface of the color filter substrate 11, aspace on the array substrate 12 located in the peripheral region NA canbe avoided from being occupied, and a width of the peripheral region NAcan be reduced, which is beneficial to realizing a narrow bezel andincreasing a screen-to-body ratio. Furthermore, the width of theperipheral region NA can be reduced to less than 1 mm. Therefore, byapplying the display panel 1 to display devices in a spliced displaydevice, a seam between two adjacent display devices in the spliceddisplay device can be reduced.

An embodiment of the present disclosure provides a spliced displaydevice. The spliced display device includes at least two displaydevices, where at least one of the at least two display devices is theabove-described display device.

In this embodiment, each display device in the spliced display deviceincludes the above-described display device. The above-described displaydevice may be a liquid crystal display device, but is not limitedthereto.

In this embodiment, since the first conductive portion 13 is provided onthe side surface of the array substrate 12 and the side surface of thecolor filter substrate 11, and the first conductive portion 13 isconnected with the pixel circuits through the second conductive portion14, the pixel circuits can be connected with a chip for controlling thepixel circuits through the first conductive portion 13. And since thefirst conductive portion 13 is located on the side surface of the arraysubstrate 12 and the side surface of the color filter substrate 11, aspace on the array substrate 12 located in the peripheral region NA canbe avoided from being occupied, and a width of the peripheral region NAcan be reduced. Therefore, a seam between two adjacent display devicesin the spliced display device can be reduced.

Of course, in other embodiments, there may exist one, two or othernumber of display devices in the spliced display device, including theabove-described display device.

An embodiment of the present disclosure provides a method ofmanufacturing a display panel 1, which is used for manufacturing theabove-described display panel 1. As shown in FIG. 20 , the method ofmanufacturing the display panel 1 includes the following steps2001-2004.

At step 2001, an array substrate 12 is formed, where the array substrate12 includes pixel circuits and a second conductive portion 14, the pixelcircuits are located in a display region AA, the second conductiveportion 14 is located in a peripheral region NA, and the secondconductive portion 14 is connected with the pixel circuits.

At step 2002, a color filter substrate 11 is formed.

At step 2003, the array substrate 12 and the color filter substrate 11are cell-assembled, and the pixel circuits and the second conductiveportion 14 are located on a side of the array substrate 12 facing thecolor filter substrate 11.

In this embodiment, after the array substrate 12 and the color filtersubstrate 11 are cell-assembled, and before a first conductive portion13 is formed on a side surface of the array substrate 12 and a sidesurface of the color filter substrate 11, impurities such as glassresidues on a surface of the second conductive portion 14 may be firstremoved in a manner of thermal shock through UV laser, so as to enhanceconductivity and adhesion of contact between the first conductiveportion 13 and the second conductive portion 14.

At step 2004, a first conductive portion 13 is formed on a side surfaceof the array substrate 12 and a side surface of the color filtersubstrate 11, where a first end E1 of the first conductive portion 13 islocated on the side surface of the color filter substrate 11, a secondend E2 of the first conductive portion 13 is located on the side surfaceof the array substrate 12, and the first conductive portion 13 isconnected with the second conductive portion 14.

In this embodiment, in step 2004, the first conductive portion 13 may befirst manufactured, and then the first conductive portion 13 may betransfer printed on the side surface of the array substrate 12 and theside surface of the color filter substrate 11 through a transferprinting process.

In this embodiment, conductive silver paste/slurry can be injected intoa high-precision screen to form the first conductive portion 13, andthen the first conductive portion 13 is transfer printed on the sidesurface of the array substrate 12 and the side surface of the colorfilter substrate 11 through a silicone pad.

In this embodiment, after the first conductive portion 13 is transferprinted on the side surface of the array substrate 12 and the sidesurface of the color filter substrate 11 through the silicone pad, thefirst conductive portion 13 can be thermally cured through infraredlaser.

In this embodiment, after the first conductive portion 13 is thermallycured through the infrared laser, COFs 16 can be bound/bonded to a sideedge of the display panel 1 through a conductive film layer 15 at acertain temperature, time and pressure.

In this embodiment, the COFs 16 can be bound/bonded to a printed circuitboard 17 through a conductive adhesive at a certain temperature, timeand pressure.

Although the present disclosure is disclosed above, the presentdisclosure is not limited thereto. Any person skilled in the art canmake various changes and modifications without departing from the spiritand scope of the present disclosure. Therefore, the protection scope ofthe present disclosure should be based on the scope defined by theclaims.

1. A display panel, comprising: a color filter substrate, an arraysubstrate and a first conductive portion, wherein a display region and aperipheral region are formed on the display panel, and the peripheralregion surrounds the display region; the color filter substrate isopposite to the array substrate; the array substrate comprises pixelcircuits and a second conductive portion, wherein the pixel circuits arelocated in the display region, and the second conductive portion islocated in the peripheral region; the second conductive portion isconnected with the pixel circuits; the pixel circuits and the secondconductive portion are located on a side of the array substrate facingthe color filter substrate; and the first conductive portion is locatedon a side surface of the array substrate and a side surface of the colorfilter substrate, a first end of the first conductive portion is locatedon the side surface of the color filter substrate, a second end of thefirst conductive portion is located on the side surface of the arraysubstrate, and the first conductive portion is connected with the secondconductive portion.
 2. The display panel according to claim 1, wherein adistance between the first end of the first conductive portion and thesecond end of the first conductive portion is smaller than a distancebetween a first surface of the color filter substrate away from thearray substrate and a second surface of the array substrate away fromthe color filter substrate.
 3. The display panel according to claim 1,wherein the first conductive portion is located between a first centralaxis of the side surface of the color filter substrate and a secondcentral axis of the side surface of the array substrate; the firstcentral axis and the second central axis are respectively perpendicularto a direction from the first end of the first conductive portion to thesecond end of the first conductive portion.
 4. The display panelaccording to claim 3, wherein the first conductive portion ismanufactured through a transfer printing process; a distance between thefirst end of the first conductive portion and the first central axis isa first distance, and a distance between the second end of the firstconductive portion and the second central axis is a second distance,wherein the first distance is equal to the second distance.
 5. Thedisplay panel according to claim 1, further comprising: chip on films,wherein the chip on films are bonded together with the first conductiveportion, and the chip on films are electrically connected with the firstconductive portion.
 6. The display panel according to claim 5, furthercomprising: a conductive film layer, wherein the conductive film layeris located between the first conductive portion and the chip on films,and the first conductive portion is in electrical communication with thechip on films through the conductive film layer.
 7. The display panelaccording to claim 6, wherein the first conductive portion comprises aplurality of first conductive portions, and the conductive film layercovers the plurality of first conductive portions; the plurality offirst conductive portions comprise a plurality of central conductiveportions and a plurality of edge conductive portions, wherein thecentral conductive portions are located in middle of the plurality offirst conductive portions, and the edge conductive portions are locatedin edges of the plurality of first conductive portions; and the chip onfilms are connected with the plurality of central conductive portionsthrough the conductive film layer.
 8. The display panel according toclaim 5, further comprising: a printed circuit board, wherein theprinted circuit board is located on a side of the chip on films awayfrom the array substrate, and is connected with the chip on films. 9.The display panel according to claim 8, wherein a width of part of achip on film located near the printed circuit board is smaller than awidth of part of the chip on film located near the array substrate. 10.The display panel according to claim 1, wherein a light emitting side ofthe color filter substrate and a light incident side of the arraysubstrate are respectively attached with a polarizer.
 11. The displaypanel according to claim 1, further comprising: a first polarizer and asecond polarizer, wherein the first polarizer is located on a side ofthe color filter substrate away from the array substrate, and the secondpolarizer is located on a side of the array substrate away from thecolor filter substrate; the color filter substrate comprises a firstedge and a second edge, wherein the first edge is located on a firstside of the color filter substrate, and the second edge is located on asecond side of the color filter substrate, wherein the second side is aside other than the first side, and the first conductive portion islocated on the first side of the color filter substrate; a distancebetween a third edge of the first polarizer located on the first sideand the first edge is 0.05^(˜)1.7 mm, and the third edge is parallel tothe first edge; a distance between a fourth edge of the first polarizerlocated on the second side and the second edge is 0^(˜)0.1 mm, and thefourth edge is parallel to the second edge; the array substratecomprises a fifth edge and a sixth edge, wherein the fifth edge islocated on the first side of the array substrate, and the sixth edge islocated on the second side of the array substrate; and a distancebetween a seventh edge of the second polarizer located on the first sideand the fifth edge is 0.1^(˜)1.7 mm, and the seventh edge is parallel tothe fifth edge; a distance between an eighth edge of the secondpolarizer located on the second side and the sixth edge is 0^(˜)0.1 mm,and the eighth edge is parallel to the sixth edge.
 12. The display panelaccording to claim 11, further comprising: a first light shieldinglayer, a second light shielding layer, a first water and oxygen barrierlayer, and a second water and oxygen barrier layer, wherein the colorfilter substrate comprises a first edge region and a first centralregion, wherein the first edge region surrounds the first centralregion; a projection of the first polarizer on the color filtersubstrate is located within the first central region; the first lightshielding layer is located on a side of the color filter substratefacing the first polarizer, and the first light shielding layer islocated in the first edge region and covers side surfaces of the firstpolarizer; the first water and oxygen barrier layer covers the firstlight shielding layer; the array substrate comprises a second edgeregion and a second central region, wherein the second edge regionsurrounds the second central region; a projection of the secondpolarizer on the array substrate is located within the second centralregion; and the second light shielding layer is located on a side of thearray substrate facing the second polarizer, and the second lightshielding layer is located in the second edge region and covers sidesurfaces of the second polarizer; the second water and oxygen barrierlayer covers the second light shielding layer.
 13. The display panelaccording to claim 1, wherein the color filter substrate comprises athird light shielding layer and a fourth light shielding layer; theperipheral region comprises a first sub-region and a second sub-region,wherein the first sub-region is located between the display region andthe first conductive portion, and the second sub-region is a regionother than the first sub-region in the peripheral region; a projectionof the third light shielding layer on the array substrate is locatedwithin the first sub-region, and a projection of the fourth lightshielding layer on the array substrate is located within the secondsub-region; and a width of the third light shielding layer is 0.6^(˜)1.0mm, and a width of the fourth light shielding layer is 0.25^(˜)0.5 mm.14. A display device, comprising: a light emitting module and a displaypanel, wherein the display panel comprises: a color filter substrate, anarray substrate and a first conductive portion, wherein a display regionand a peripheral region are formed on the display panel, and theperipheral region surrounds the display region; the color filtersubstrate is opposite to the array substrate; the array substratecomprises pixel circuits and a second conductive portion, wherein thepixel circuits are located in the display region, and the secondconductive portion is located in the peripheral region; the secondconductive portion is connected with the pixel circuits; the pixelcircuits and the second conductive portion are located on a side of thearray substrate facing the color filter substrate; the first conductiveportion is located on a side surface of the array substrate and a sidesurface of the color filter substrate, a first end of the firstconductive portion is located on the side surface of the color filtersubstrate, a second end of the first conductive portion is located onthe side surface of the array substrate, and the first conductiveportion is connected with the second conductive portion; and the displaypanel is located on a light emitting side of the light emitting module,and the array substrate is located between the color filter substrateand the light emitting module.
 15. The display device according to claim14, wherein the light emitting module comprises a back plate, a middleframe, an optical film layer and a light plate, wherein the back platecomprises a bottom plate and a side wall; the light plate is located ona side of the bottom plate facing the display panel, and comprises aplurality of light sources; the middle frame is disposed around theplurality of light sources, and is fixedly connected with the side wall;the middle frame is located between the bottom plate and the opticalfilm layer.
 16. The display device according to claim 15, wherein aprojection of the optical film layer on the color filter substrate islocated within a projection of the array substrate on the color filtersubstrate, and a projection of the middle frame on the array substrateis located within a projection of the optical film layer on the arraysubstrate.
 17. The display device according to claim 16, furthercomprising: a fifth light shielding layer and a metal layer, wherein thefifth light shielding layer is located on a side surface of the colorfilter substrate and a side surface of the array substrate; the metallayer covers the fifth light shielding layer, and is located on a sidesurface of the light emitting module; when the display panel comprises afirst polarizer, a first end of the metal layer is located on a side ofthe first polarizer away from the color filter substrate and located inthe peripheral region, and a second end of the metal layer is located ona side of the light emitting module away from the display panel. 18-38.(canceled)
 39. A spliced display device, comprising: at least twodisplay devices, and at least one of the at least two display devices isthe display device according to claim
 14. 40. A method of manufacturinga display panel, wherein a display region and a peripheral region areformed on the display panel, and the peripheral region surrounds thedisplay region; and the method comprises: forming an array substrate,wherein the array substrate comprises pixel circuits and a secondconductive portion, the pixel circuits are located in the displayregion, the second conductive portion is located in the peripheralregion, and the second conductive portion is connected with the pixelcircuits; forming a color filter substrate; cell-assembling the arraysubstrate and the color filter substrate, wherein the pixel circuits andthe second conductive portion are located on a side of the arraysubstrate facing the color filter substrate; and forming a firstconductive portion on a side surface of the array substrate and a sidesurface of the color filter substrate, wherein a first end of the firstconductive portion is located on the side surface of the color filtersubstrate, a second end of the first conductive portion is located onthe side surface of the array substrate, and the first conductiveportion is connected with the second conductive portion.
 41. The methodaccording to claim 40, wherein forming the first conductive portion onthe side surface of the array substrate and the side surface of thecolor filter substrate comprises: manufacturing the first conductiveportion; and transfer printing the first conductive portion on the sidesurface of the array substrate and the side surface of the color filtersubstrate through a transfer printing process.